Multi-chip package (NAND MCP) products are designed on the same substrate based on different storage technology processes. The superior chip stacking technology not only optimizes the design space of circuit boards, but also different storage technology products, including SLC NAND Flash and mobile DRAM. The power consumption DDR1, DDR2 or DDR4 is designed on a substrate. For applications to achieve faster startup time, longer battery life and higher reliability, the combination of mainstream NAND MCP products is 1Gb + 512Mb; 2Gb + 1Gb; 4Gb + 2Gb; 4Gb + 4Gb (NAND and low power DRAM).
Jeju Semiconductor is one of the world largest SRAM solutions provider for mobile applications
Since Jeju Semiconductor made a debut to the SRAM (Static Random Access Memory) market in 2001 with 4M SRAM, Jeju Semiconductor continued implementing full lineup of low power SRAM products through 1M, 2M, 4M to 8M SRAM.
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Jeju Semiconductor is one of the world largest SRAM solutions provider for mobile applications
